PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering ---------------------------- Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP (dual in-line package) DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1 DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1 LQFP (low profile quad flat package) LQFP64 plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm LQFP100 plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 LQFP128 plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 SOT314-2 QFP (quad flat package) QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 SIL (single in-line) SIL9MP plastic single in-line medium power package; 9 leads SOT142-1 SO (small outline) SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 SO8 plastic small outline package; 8 leads; body width 7.5 mm SOT176-1 SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 SSOP (shrink small outline package) SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 VSO (very small outline) VSO40 plastic very small outline package; 40 leads SOT158-1 VSO56 plastic very small outline package; 56 leads SOT190-1 1997 Apr 02 2 PAGE Philips Semiconductors Package information Package outlines DIP DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 3 Philips Semiconductors Package information Package outlines DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.2 inches 0.17 0.020 0.13 0.068 0.044 0.021 0.015 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT27-1 050G04 MO-001AA 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-03-11 4 Philips Semiconductors Package information Package outlines DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 5 Philips Semiconductors Package information Package outlines DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 1997 Apr 02 REFERENCES IEC JEDEC EIAJ SC603 6 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Package information Package outlines seating plane DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1 ME D A2 L A A1 c e Z b1 w M (e 1) b MH 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 32.0 31.4 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 2.2 inches 0.20 0.020 0.16 0.066 0.051 0.021 0.015 0.013 0.009 1.26 1.24 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT101-1 051G02 MO-015AD 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-23 7 Philips Semiconductors Package information Package outlines seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 8 Philips Semiconductors Package information Package outlines seating plane DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 21 40 pin 1 index E 1 20 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.7 0.51 4.0 1.70 1.14 0.53 0.38 0.36 0.23 52.50 51.50 inches 0.19 0.020 0.16 0.067 0.045 0.021 0.015 0.014 0.009 2.067 2.028 D (1) e e1 L ME MH w Z (1) max. 14.1 13.7 2.54 15.24 3.60 3.05 15.80 15.24 17.42 15.90 0.254 2.25 0.56 0.54 0.10 0.60 0.14 0.12 0.62 0.60 0.69 0.63 0.01 0.089 E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT129-1 051G08 MO-015AJ 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 9 Philips Semiconductors Package information Package outlines LQFP LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 wM bp pin 1 index 64 Lp L 17 1 detail X 16 ZD e v M A wM bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.60 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 10.1 9.9 10.1 9.9 0.5 HD HE 12.15 12.15 11.85 11.85 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) 1.45 1.05 7 0o 1.45 1.05 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-08-01 SOT314-2 1997 Apr 02 EUROPEAN PROJECTION 10 Philips Semiconductors Package information Package outlines LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 c y X A 51 75 50 76 ZE e E HE A A2 (A 3) A1 w M bp Lp L pin 1 index 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.20 0.05 1.5 1.3 0.25 0.28 0.16 0.18 0.12 14.1 13.9 14.1 13.9 0.5 HD HE 16.25 16.25 15.75 15.75 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) 1.15 0.85 7 0o 1.15 0.85 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-08-04 SOT407-1 1997 Apr 02 EUROPEAN PROJECTION 11 Philips Semiconductors Package information Package outlines LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 c y X A 65 102 64 103 ZE e E HE A A2 A 1 (A 3) wM Lp bp pin 1 index L detail X 39 128 1 38 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 20.1 19.9 14.1 13.9 0.5 HD HE 22.15 16.15 21.85 15.85 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D(1) Z E(1) 0.81 0.59 7 0o 0.81 0.59 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-04-02 97-08-04 SOT425-1 1997 Apr 02 EUROPEAN PROJECTION 12 Philips Semiconductors Package information Package outlines QFP QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.10 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 10.1 9.9 0.8 12.9 12.3 12.9 12.3 1.3 0.95 0.55 0.15 0.15 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 o 10 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT307-2 1997 Apr 02 EUROPEAN PROJECTION 13 Philips Semiconductors Package information Package outlines SIL SIL9MP: plastic single in-line medium power package; 9 leads SOT142-1 D D1 A2 D2 A3 seating plane E A pin 1 index c L 1 9 b e Z b2 Q w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 b b1 b2 c D (1) D1 D2 E (1) e L Q w Z (1) max. mm 12 11 3.7 1.8 1.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 18.6 18.2 6.48 6.20 2.54 3.9 3.4 1.75 1.55 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-09 97-12-16 SOT142-1 1997 Apr 02 EUROPEAN PROJECTION 14 Philips Semiconductors Package information Package outlines SO SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 15 o 8 0o Philips Semiconductors Package information Package outlines SO8: plastic small outline package; 8 leads; body width 7.5 mm SOT176-1 D E A X c y HE v M A Z 8 5 Q A2 A (A 3) A1 pin 1 index Lp L 1 4 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 7.65 7.45 7.6 7.4 1.27 10.65 10.00 1.45 1.1 0.45 1.1 1.0 0.25 0.25 0.1 2.0 1.8 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.30 0.29 0.30 0.29 0.050 0.419 0.057 0.394 0.043 0.018 0.043 0.039 0.01 0.01 0.004 0.079 0.071 inches 0.10 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-25 97-05-22 SOT176-1 1997 Apr 02 EUROPEAN PROJECTION 16 o 8 0o Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 17 Philips Semiconductors Package information Package outlines SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 18 Philips Semiconductors Package information Package outlines SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 19 Philips Semiconductors Package information Package outlines SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 20 Philips Semiconductors Package information Package outlines SSOP SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.5 0.15 0 1.4 1.2 0.25 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-04-05 95-02-25 SOT266-1 1997 Apr 02 EUROPEAN PROJECTION 21 o Philips Semiconductors Package information Package outlines VSO VSO40: plastic very small outline package; 40 leads SOT158-1 D E A X c y HE v M A Z 40 21 Q A2 A (A 3) A1 pin 1 index Lp L 1 detail X 20 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 2.70 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 12.3 11.8 2.25 1.7 1.5 1.15 1.05 0.2 0.1 0.1 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.30 0.29 0.03 0.48 0.46 0.067 0.089 0.059 inches 0.11 0.045 0.024 0.008 0.004 0.004 0.041 0.012 7o 0o Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-24 SOT158-1 1997 Apr 02 EUROPEAN PROJECTION 22 Philips Semiconductors Package information Package outlines VSO56: plastic very small outline package; 56 leads SOT190-1 D E A X c y HE v M A Z 56 29 Q A2 A (A 3) A1 pin 1 index Lp L 1 detail X 28 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 3.3 0.3 0.1 3.0 2.8 0.25 0.42 0.30 0.22 0.14 21.65 21.35 11.1 11.0 0.75 15.8 15.2 2.25 1.6 1.4 1.45 1.30 0.2 0.1 0.1 0.90 0.55 0.13 0.012 0.004 0.12 0.11 0.01 0.017 0.0087 0.85 0.012 0.0055 0.84 inches 0.44 0.62 0.0295 0.43 0.60 0.063 0.089 0.055 0.057 0.035 0.008 0.004 0.004 0.051 0.022 Note 1. Plastic or metal protrusions of 0.3 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-04-02 97-08-11 SOT190-1 1997 Apr 02 EUROPEAN PROJECTION 23 o 7 0o